Upgrade thermald to release 2.5.13.

Upgrade ThermalD from 2.5.12 to 2.5.13 and rename the recipe
accordingly.

This update includes the following changes:

- Restrict Qualcomm SPEL PL initialization to XML-defined cooling
  devices only.
- Fix handling of large RAPL PL1 values during restore registration.
- Re-add Wildcat Lake platform support.

Signed-off-by: Priyansh Jain <priyansh.jain@oss.qualcomm.com>
Signed-off-by: Khem Raj <khem.raj@oss.qualcomm.com>

meta-oe/recipes-bsp/thermald/thermald_2.5.13.bb

@@ -17,7 +17,7 @@ SRC_URI = " \
     file://0001-thd_gddv-fix-building-on-32-bit-systems.patch \
 "
 
-SRCREV = "9996a1a1cdd01d32cd411459368a177f463d0047"
+SRCREV = "5fdc5bbca7f8c3f5bb2ad6540e8211a159a88a3a"
 
 inherit pkgconfig autotools systemd gtk-doc