* It breaks libgles/SGX due to missing omafb/omafb.h header
* Will be switching to 3.14 instead for LTS
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
Acked-by: Chase Maupin <chase.maupin@ti.com>
* Add a missing space to KERNEL_CONFIG_FRAGMENTS_append
* Use FILESEXTRAPATHS_prepend instead of _append version
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
* Add version 3.15 of the TI integration kernel. Major changes
from previous version are:
* Config fragments now come primarily from the integration
tree. Removed baseport and connectivity fragments for now
and the others can be removed as they are added to the
integration tree.
* Added a non-smp.cfg config to disable SMP for single core
devices instead of using a patch to the defconfig file as
we did in the past.
* Use the right SRCREV
Signed-off-by: Chase Maupin <Chase.Maupin@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
* Allow the use of in-kernel config fragments instead of only
pulling config fragments from the OE meta data.
* The absolute path to the config fragment is used to allow
pointing to different fragment locations.
* Update the linux-ti-staging_3.12 recipe which uses config
fragments to specify the absolute path
Signed-off-by: Chase Maupin <Chase.Maupin@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
* As we add the next version of the linux-ti-staging kernel there
will be a different list of config fragments, removed patches,
etc. For this reason it makes sense to have the file directory
be version specific
Signed-off-by: Chase Maupin <Chase.Maupin@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
* The 3.8 version is replaced with v3.12 which has full support
for all devices.
* As part of adding a v3.15 version cleanup the v3.8 version to
reduce the number of kernels to latest and last stable.
Signed-off-by: Chase Maupin <Chase.Maupin@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
Also version 1.9.0.10 of the recipe doesn't have necessary PROVIDES and
results in conflicts with mesa and other gl/gles providers.
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
Acked-by: Chase Maupin <chase.maupin@ti.com>
* Pulled in latest version 1.9.0.12 from meta-ti-gsldk and
preserved authorship for Mrinmayee
* Mark this recipe as providing the gles1, gles2, and egl
libraries so that it doesn't conflict with other recipes like
mesa and will be pulled in to satisfy those dependencies
Signed-off-by: Mrinmayee Hingolikar <mrinmayee@ti.com>
Signed-off-by: Chase Maupin <Chase.Maupin@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
* Add sgx to the MACHINE_FEATURES so that the dra7xx-evm can
start including sgx libraries. NOTE: currently there are
no driver modules that work with v3.12 of the Linux kernel
but this does work with version 3.8.
Signed-off-by: Chase Maupin <Chase.Maupin@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
* Migrated from meta-ti-glsdk and preserved authorship for
Mrinmayee
* This library allows use of the GC320 2D blitter
* Modified for upstream:
* LICENSE was changed to BSD-3-Clause but the TI-TSPA license
is still present as well so modified this to be a dual
license package.
Signed-off-by: Chase Maupin <Chase.Maupin@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
* Migrated from meta-ti-glsdk and preserved authorship for
Karthik
* Modified for upstream:
* Made PACKAGE_ARCH machine specific
* Removed bogus HOMEPAGE setting
* Separated the firmware into a ${PN}-fw package and left the
ARM side RadioApp in the base package.
Signed-off-by: Chase Maupin <Chase.Maupin@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
* Migrated the dspdce-fw recipe from meta-ti-glsdk and
preserved authorship for Mrinmayee.
* Cleaned up for upstream:
* Removed the MACHINE name from the recipe name
* Used MACHINE variable in SRC_URI
* Update to use default variables such as base_libdir
Signed-off-by: Chase Maupin <Chase.Maupin@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
* Based on recipes from meta-ti-glsdk and preserved authorship
for Mrinmayee
* Modified for upstreaming:
* Combined the dra7xx-evm and omap5-evm versions into a
shared recipe. This changes the recipe name to just
ipumm-fw.
Signed-off-by: Chase Maupin <Chase.Maupin@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
* Update the 3.00.00 and 3.21.00.07 versions of ti-ipc to use
a common ti-ipc.inc file which combines the configuration and
installation steps for both to be common.
* Modify the tiiipclad-daemon.sh script to have a replacement
variable so that it can be used for more than a single device.
* Move the tiipclad-daemon script to the ti-ipc directory with
the rest of the files used by this recipe.
* Fix the permissions for the tiipclad-daemon script
Signed-off-by: Chase Maupin <Chase.Maupin@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
* Added version 3.21.00.07 from the meta-ti-glsdk layer.
Preserved authorship by Mrinmayee
* Cleaned up the recipe for upstream by removing the sed lines
in do_configure and instead using EXTRA_OEMAKE values passed
into the make process.
Signed-off-by: Chase Maupin <Chase.Maupin@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
* The ti-ipc.inc file was for the legacy 1.24.00.16 version of
ti-ipc. So consolidate these files together since there is
only one version of the ti-ipc recipe that needs that .inc
file and there are no updates planned for it.
Signed-off-by: Chase Maupin <Chase.Maupin@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
k2l-evm machine config shares the same Keystone SoC family, it has K2L EVM
specific machine configuration for UBI image, boot monitor, U-boot, etc.
Signed-off-by: Hao Zhang <hzhang@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
Keystone II SOC family has multiple devices and EVMs: k2hk, k2l
and k2e, each EVM should have a separate machine config, and share
the common keystone SOC family.
Signed-off-by: Hao Zhang <hzhang@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
Modified version of the original patch from Sam Nelson
* Update source URL/REV
* Added SPI NOR binaries and deployed images
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
Do not apply systest fragment by default on the production build.
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
Reviewed-by: Chase Maupin <chase.maupin@ti.com>
* Use in-kernel merge_config.sh script and KERNEL_CONFIG_FRAGMENTS list
* Move copying provided defconfig from own task to do_configure() for atomicity
* Don't use curly brackets for shell variables to avoid conflict with Bitbake
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
Reviewed-by: Chase Maupin <chase.maupin@ti.com>
The new Texas Instruments Text File License (TI-TFL) is now replacing the
old Technology and Software Publicly Available (TSPA) license. But there are
older versions of the components previously released under TI-TSPA license.
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
Acked-by: Chase Maupin <chase.maupin@ti.com>
Acked-by: Franklin Cooper Jr. <fcooper@ti.com>
- The keystone-evm actually has 512 MB Nand
( Changing from previous size of 128 MB)
- LEB calculated with reserved 10 MB for boot and 20 MB
for receovery image
Signed-off-by: Sam Nelson <sam.nelson@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
Instead of creating all folders, only create those that exist
in the Graphics SDK. This fixes QA issue with unshipped ES9.0
folder which does not exists in 4.09.00.01.
Signed-off-by: Samuli Piippo <samuli.piippo@digia.com>
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
- Supports communication between processors in TI keystone architecture
Signed-off-by: Sam Nelson <sam.nelson@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
* Add latest version of the Graphics SDK that includes bug fixes.
* Fixed Suspend and Resume issue on AM43x.
Signed-off-by: Franklin S. Cooper Jr <fcooper@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
Hao Zhang
Denys Dmytriyenko
Maupin, Chase
Andreas Müller
Mrinmayee Hingolikar
Karthik Ramanan
Sam Nelson
Samuli Piippo
Franklin S. Cooper Jr