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Priyansh Jain
ecb26492f0
Upgrade ThermalD from 2.5.12 to 2.5.13 and rename the recipe accordingly. This update includes the following changes: - Restrict Qualcomm SPEL PL initialization to XML-defined cooling devices only. - Fix handling of large RAPL PL1 values during restore registration. - Re-add Wildcat Lake platform support. Signed-off-by: Priyansh Jain <priyansh.jain@oss.qualcomm.com> Signed-off-by: Khem Raj <khem.raj@oss.qualcomm.com>
Collection of layers for the OE-core universe
Main layer maintainer: Khem Raj raj.khem@gmail.com
This repository is a collection of layers to supplement OE-Core with additional packages, Each layer have designated maintainer Please see the respective READMEs in the layer subdirectories