* Add sgx to the MACHINE_FEATURES so that the dra7xx-evm can
start including sgx libraries. NOTE: currently there are
no driver modules that work with v3.12 of the Linux kernel
but this does work with version 3.8.
Signed-off-by: Chase Maupin <Chase.Maupin@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
* Migrated from meta-ti-glsdk and preserved authorship for
Mrinmayee
* This library allows use of the GC320 2D blitter
* Modified for upstream:
* LICENSE was changed to BSD-3-Clause but the TI-TSPA license
is still present as well so modified this to be a dual
license package.
Signed-off-by: Chase Maupin <Chase.Maupin@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
* Migrated from meta-ti-glsdk and preserved authorship for
Karthik
* Modified for upstream:
* Made PACKAGE_ARCH machine specific
* Removed bogus HOMEPAGE setting
* Separated the firmware into a ${PN}-fw package and left the
ARM side RadioApp in the base package.
Signed-off-by: Chase Maupin <Chase.Maupin@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
* Migrated the dspdce-fw recipe from meta-ti-glsdk and
preserved authorship for Mrinmayee.
* Cleaned up for upstream:
* Removed the MACHINE name from the recipe name
* Used MACHINE variable in SRC_URI
* Update to use default variables such as base_libdir
Signed-off-by: Chase Maupin <Chase.Maupin@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
* Based on recipes from meta-ti-glsdk and preserved authorship
for Mrinmayee
* Modified for upstreaming:
* Combined the dra7xx-evm and omap5-evm versions into a
shared recipe. This changes the recipe name to just
ipumm-fw.
Signed-off-by: Chase Maupin <Chase.Maupin@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
* Update the 3.00.00 and 3.21.00.07 versions of ti-ipc to use
a common ti-ipc.inc file which combines the configuration and
installation steps for both to be common.
* Modify the tiiipclad-daemon.sh script to have a replacement
variable so that it can be used for more than a single device.
* Move the tiipclad-daemon script to the ti-ipc directory with
the rest of the files used by this recipe.
* Fix the permissions for the tiipclad-daemon script
Signed-off-by: Chase Maupin <Chase.Maupin@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
* Added version 3.21.00.07 from the meta-ti-glsdk layer.
Preserved authorship by Mrinmayee
* Cleaned up the recipe for upstream by removing the sed lines
in do_configure and instead using EXTRA_OEMAKE values passed
into the make process.
Signed-off-by: Chase Maupin <Chase.Maupin@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
* The ti-ipc.inc file was for the legacy 1.24.00.16 version of
ti-ipc. So consolidate these files together since there is
only one version of the ti-ipc recipe that needs that .inc
file and there are no updates planned for it.
Signed-off-by: Chase Maupin <Chase.Maupin@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
k2l-evm machine config shares the same Keystone SoC family, it has K2L EVM
specific machine configuration for UBI image, boot monitor, U-boot, etc.
Signed-off-by: Hao Zhang <hzhang@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
Keystone II SOC family has multiple devices and EVMs: k2hk, k2l
and k2e, each EVM should have a separate machine config, and share
the common keystone SOC family.
Signed-off-by: Hao Zhang <hzhang@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
Modified version of the original patch from Sam Nelson
* Update source URL/REV
* Added SPI NOR binaries and deployed images
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
Do not apply systest fragment by default on the production build.
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
Reviewed-by: Chase Maupin <chase.maupin@ti.com>
* Use in-kernel merge_config.sh script and KERNEL_CONFIG_FRAGMENTS list
* Move copying provided defconfig from own task to do_configure() for atomicity
* Don't use curly brackets for shell variables to avoid conflict with Bitbake
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
Reviewed-by: Chase Maupin <chase.maupin@ti.com>
The new Texas Instruments Text File License (TI-TFL) is now replacing the
old Technology and Software Publicly Available (TSPA) license. But there are
older versions of the components previously released under TI-TSPA license.
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
Acked-by: Chase Maupin <chase.maupin@ti.com>
Acked-by: Franklin Cooper Jr. <fcooper@ti.com>
- The keystone-evm actually has 512 MB Nand
( Changing from previous size of 128 MB)
- LEB calculated with reserved 10 MB for boot and 20 MB
for receovery image
Signed-off-by: Sam Nelson <sam.nelson@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
Instead of creating all folders, only create those that exist
in the Graphics SDK. This fixes QA issue with unshipped ES9.0
folder which does not exists in 4.09.00.01.
Signed-off-by: Samuli Piippo <samuli.piippo@digia.com>
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
- Supports communication between processors in TI keystone architecture
Signed-off-by: Sam Nelson <sam.nelson@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
* Add latest version of the Graphics SDK that includes bug fixes.
* Fixed Suspend and Resume issue on AM43x.
Signed-off-by: Franklin S. Cooper Jr <fcooper@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
Maupin, Chase
Mrinmayee Hingolikar
Karthik Ramanan
Hao Zhang
Denys Dmytriyenko
Sam Nelson
Samuli Piippo
Franklin S. Cooper Jr
Baptiste DURAND