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5023dca1de
This reverts commit d29025f7e8.
* associated fix in k3-image-gen is picked up now.
commit 892c86501ff7 ("Makefile: Skip signing of binaries for HS combined boot")
hence its no longer needed to carry the same fix from meta-ti here.
Signed-off-by: Praneeth Bajjuri <praneeth@ti.com>
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
The official OpenEmbedded/Yocto BSP layer for Texas Instruments platforms. It is hosted on http://git.yoctoproject.org/cgit/cgit.cgi/meta-ti/ with the source repository at git://git.yoctoproject.org/meta-ti This layer depends on: URI: git://git.openembedded.org/openembedded-core layers: meta branch: dunfell URI: git://git.yoctoproject.org/meta-arm layers: meta-arm branch: dunfell The base BSP part of meta-ti should work with different OpenEmbedded/Yocto distributions and layer stacks, such as: distro-less (only with OE-Core), with Yocto/Poky, with Angstrom or Arago. Please follow the recommended setup procedures of your OE distribution. Send pull requests, patches, comments or questions to: meta-ti@lists.yoctoproject.org Please note - meta-ti mailing list requires subscription for posting: https://lists.yoctoproject.org/g/meta-ti Maintainers: Praneeth Bajjuri <praneeth@ti.com> Denys Dmytriyenko <denys@konsulko.com>